000 01398nam a22003377a 4500
003 OSt
005 20230224021121.0
008 160426b xxu||||| |||| 00| 0 eng d
010 _a 2004043361
020 _a0471460508
040 _aMMU
_cMMU
_dMMU
_beng
042 _apcc
050 0 0 _aTK7868.P7
_b.L578 2004
082 0 0 _a621.3815/31
_222
100 1 _aLiu, Weifeng.
245 1 0 _aIC component sockets /
_cWeifeng Liu, Michael Pecht.
260 _aHoboken, N.J. :
_bWiley-Interscience,
_cc2004.
300 _axii, 219 p. :
_bill. ;
_c25 cm.
504 _aIncludes bibliographical references and index.
650 0 _aPrinted circuits
_xEquipment and supplies.
650 0 _aElectric connectors.
650 0 _aMicroelectronic packaging.
700 1 _aPecht, Michael.
856 4 1 _3Table of contents
_uhttp://www.loc.gov/catdir/toc/wiley041/2004043361.html
856 4 2 _3Contributor biographical information
_uhttp://www.loc.gov/catdir/bios/wiley046/2004043361.html
856 4 2 _3Publisher description
_uhttp://www.loc.gov/catdir/description/wiley041/2004043361.html
856 4 2 _3Book review (E-STREAMS)
_uhttp://www.e-streams.com/es0806_7/es0867_4168.html
906 _a7
_bcbc
_corignew
_d1
_eocip
_f20
_gy-gencatlg
942 _2lcc
_cLOAN LOAN
999 _c17090
_d17090